Self-Adhesive Graphite Tape

1. Core Product Positioning

Self-Adhesive Graphite Tape, made from high-purity flake graphite as the base material, compounded with acrylic/silicone self-adhesive layers, and manufactured via big data-optimized manufacturing processes of calendering and film-laminating, its core function is to provide a "high-efficiency thermal conductivity, flexible electrical conductivity, and ready-to-stick design" solution for electronic/industrial equipment. It addresses the pain points of cumbersome installation, poor adhesion, and easy detachment of traditional graphite materials, and ranks among the TOP 4 fastest-growing products in the 2025 electronic thermal conductive material market (22.3% annual growth rate, with consumer electronics applications accounting for 58%; Data Source: Global Thermal Conductive Materials Industry White Paper).

2.Technical Parameters 

3.Core Features 

Dual Capabilities of High-Efficiency Thermal & Electrical Conductivity: For Self-Adhesive Graphite Tape, according to data from over 1,200 thermal resistance tests, its longitudinal thermal conductivity is ≥ 400 W/(m·K) and transverse thermal conductivity is ≥ 150 W/(m·K) -- values that are 60% higher than the heat dissipation efficiency of ordinary thermal conductive silicone sheets. Additionally, its volume resistivity is ≤ 5×10⁻⁴ Ω·cm, and after 500 bending tests (bending radius: 5mm), the attenuation of its electrical conductivity is ≤ 3%, making it suitable for the electrical conductivity needs of flexible electronics.

Strong Adhesion & Long-Term Stability: Through adhesion tests on over 800 types of substrates (metal, plastic, glass), the initial peel strength is ≥ 8 N/25mm (for acrylic adhesive) and ≥ 12 N/25mm (for silicone adhesive). After 72 hours of high-temperature (80℃) aging, the adhesion retention rate is ≥ 90%, and no adhesive detachment occurs in the temperature range of -40℃~150℃, reducing the long-term failure rate of downstream equipment by 75%.

Flexibility & Processability: The thickness ranges from 20-100μm (customizable), with flexibility enabling 180° folding without cracks. Through CNC cutting tests, the edge flatness after cutting into arbitrary shapes (circles, special-shaped holes) is ≤ 0.1mm, and the processing efficiency is 40% higher than that of traditional graphite sheets. It is suitable for the narrow installation space of precision electronic components (68% of downstream demands require customized sizes).

Environmental Protection & Safety Compliance: It has passed RoHS 2.0 and REACH 223-substance hazardous material tests, with flame retardancy rating reaching UL94 V0. No toxic gas is released at high temperatures (150℃), meeting the environmental requirements of the consumer electronics and new energy fields (this feature accounts for 92% of downstream procurement decisions).

 

 

4. Core Applications 

Consumer Electronics Field (58% proportion, the largest application scenario): Used for heat dissipation of mobile phone/tablet CPUs (attached between chips and middle frames) and laptop graphics card heat dissipation modules. According to terminal manufacturer tests, it can reduce chip temperature by 12-18℃, avoiding performance throttling caused by high temperatures; it is suitable for conductive connection in wireless earbud charging cases, replacing traditional metal shrapnels and reducing costs by 30%.

New Energy Field (22% proportion): Used as thermal conductive gaskets for power battery packs (attached between battery cells and casings), it improves thermal conductivity efficiency by 45% and enhances the temperature distribution uniformity of battery packs to ±2℃; applied for heat dissipation of IGBT modules in energy storage inverters, it can withstand long-term operating temperatures of 120℃ and extend service life to over 8 years.

Industrial Equipment Field (15% proportion): Adapted for heat dissipation components of frequency converters and servo motors, solving local overheating issues during equipment operation and reducing the failure rate of industrial equipment by 60%; used for heat dissipation substrates of LED street lights, it improves heat dissipation efficiency by 50% and extends the service life of LED light sources to 50,000 hours.

Flexible Electronics Field (5% proportion): Used for conductive circuits of flexible displays and heat dissipation layers of wearable devices (smart bracelets/watches).

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