Ultrafine Graphite Powder Specifications & Properties
| Particle Size | 0.5-20 μm (adjustable for specific dispersion requirements) |
| Carbon Content | 99.5-99.99% (ultra-low ash for impurity-free performance) |
Key Properties of Ultrafine Graphite Powder
| Superior Dispersibility | Uniform particle distribution prevents agglomeration in matrices like coatings and slurries | |
| Enhanced Conductivity |
Electrical: 30%+ higher conductivity than conventional graphite |
|
| Thermal | 5-8× thermal conductivity vs. standard non-metallic powders | |
| Advanced Tribology | 20-40% lower friction coefficient through stable lubricating film formation | |
| Chemical Stability | Resists acids/alkalis/organic solvents (-50°C to 200°C) | |
| Cryogenic Performance | Maintains integrity in polar/refrigeration applications without embrittlement | |
Technical Advantages
| Balanced Physicochemical Properties | Optimized specific surface area and tap density enable simultaneous dispersion control and formability of Ultrafine Graphite Powder |
| Low Resistivity | Ideal conductivity for electrode materials and conductive additives |
Application Fields
| Electronics | Li-battery conductive agents, flexible circuit inks, EM shielding |
| Thermal Management | LED coatings, 5G thermal gaskets,EV battery gels |
| Precision Manufacturing | Aero-engine greases, micro-bearing lubricants |
| New Energy | Fuel cell membrane additives, PV module adhesives |
|
Index Range (Example) |
|
|
Particle Size (D50) |
1μm ~ 20μm (customizable) |
|
Carbon Content |
≥99.9% |
|
Ash Content |
≤0.1% |
|
Specific Surface Area (BET) |
5~50 m²/g |
|
Tap Density |
0.3~0.5 g/cm³ |
|
Resistivity |
10⁻⁴~10⁻³ Ω·cm |
Note: Products support personalized customization.
Supplementary Notes
• The particle size can be precisely adjusted according to requirements, meeting the dispersion needs of various scenarios from fine coatings to composite materials;
• The high carbon and low ash characteristics ensure purity requirements in electronics, new energy and other fields, reducing impurity interference;
• The moderate specific surface area and tap density balance the dispersibility and formability of the material, adapting to multiple processes such as slurry preparation and compression molding;
• The low resistivity endows it with excellent conductivity, making it an ideal choice for conductive additives and electrode materials.


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