Thermal Graphite Paper Ultra Thin

With "ultra-thin form factor" and "high-efficiency horizontal thermal conductivity" as its core competitive edges, ultra-thin graphite paper relies on natural or synthetic graphite raw materials and precision molding technology. At the extreme thickness of ≤0.05mm, it achieves in-plane thermal conductivity far exceeding that of traditional heat dissipation materials, while balancing flexibility and structural stability. Specifically designed for thermal management needs of devices with limited space and lightweight requirements, it constructs a high-efficiency heat dissipation solution featuring "rapid horizontal heat diffusion + composite vertical heat conduction", addressing the industry pain points of traditional materials such as bulkiness and uneven thermal conductivity.

Note: All products can be customized.

(I) Excellent Thermal Conductivity with Distinctive Directional Conduction Advantages

Outstanding horizontal thermal conductivity: Natural graphite-based products reach ≥500W/(m·K), synthetic graphite-based products ≥700W/(m·K), and high-end models can achieve 800-1600W/(m·K). This is 2-4 times that of copper (approximately 400W/(m·K)) and over 100 times that of silica gel (≤10W/(m·K)). The in-plane thermal diffusion rate is as low as 0.8s/cm², enabling rapid elimination of local hot spots.

Clear thermal conductivity direction: The vertical thermal conductivity is relatively low (10-30W/(m·K)). It can form a complementary heat dissipation system when matched with metal heat sinks and heat pipes, maximizing thermal management efficiency.

(II) Extreme Ultra-Thin Form Factor for Precision Scenarios

Strict thickness control: The standard thickness is ≤0.05mm, with mass production achievable at 0.025mm. The thickness tolerance is ≤±0.01mm (for specifications below 0.05mm), and the thickness variation of a single sheet is ≤0.01mm, allowing embedding into various narrow and precision structures.

Significant lightweight advantage: With a density of only 1.0-1.7g/cm³, it is 70% lighter than copper and 35% lighter than aluminum of the same size. It does not increase the overall volume and weight of devices, facilitating the design of ultra-thin products.

(III) Excellent Physical and Chemical Stability

Reliable mechanical properties: With a tensile strength of ≥5.0MPa, it boasts excellent flexibility, allowing free cutting and bending. It can fit both flat and curved surfaces, adapting to devices with complex shapes, and is easy to composite with metals, insulating layers, and double-sided adhesives.

Strong temperature and weather resistance: The operating temperature range covers -40℃ to 400℃, and some high-end models can work stably from -200℃ to 300℃. The thermal weight loss at 450℃ is ≤1.0%, featuring high chemical stability and corrosion resistance.

Strict purity and impurity control: Ash content ≤0.50%, sulfur content ＜1000μg/g, chlorine content ≤50μg/g. High-purity models can reach a purity of 99.9%, meeting the environmental and performance requirements of high-end fields such as electronics and aerospace.

(IV) Additional Performance and Processing Convenience

Rich additional functions: Some products have an electromagnetic shielding effectiveness of ＞60dB, far exceeding that of traditional copper foil (＜30dB), capable of meeting dual requirements of heat dissipation and electromagnetic shielding.

Easy processing and customization: It can be made into any shape through die-cutting and laser engraving, supporting gradient thermal conduction channel design. The local thermal conductivity difference can reach 500W/(m·K), adapting to personalized heat dissipation needs.

Consumer Electronics 

It is suitable for heat dissipation of components such as chips, batteries, and screens in ultra-thin products like smartphones, tablets, laptops, and smart wearables. Test data shows that the 0.025mm model can reduce the hot spot temperature of the motherboard from 98℃ to 72℃, extend the battery cycle life to 1200 times (far exceeding the national standard of 500 times), and help reduce the overall device thickness by 0.4mm, enabling an ultra-thin design of 7.6mm.

 New Energy Field

Power batteries: Used for heat dissipation of battery cells in new energy vehicles and energy storage batteries, balancing the temperature of battery packs and improving cycle life and safety.

Fuel cells: As the base material for gas diffusion layers of proton exchange membrane fuel cells, products treated with 1600℃ high-temperature graphitization have high conductivity and air permeability, adapting to operating environments of 50-80℃ and ≥60% humidity.

Aerospace and High-End Equipment

It is used for heat dissipation of precision electronic components and radar systems in aerospace equipment, as well as integrated sealing and thermal conduction components under high-temperature and high-pressure scenarios. With its lightweight, high-temperature resistance, and low-impurity characteristics, it meets aerospace-grade material standards, and some enterprises have participated in supporting large-scale aerospace projects.

Automotive Electronics and Industrial Control

Automotive electronics: Suitable for on-board chips, radars, and battery management systems (BMS), withstanding extreme temperature changes in vehicles to ensure stable operation of equipment.

Industrial control: Used for heat dissipation and sealing of industrial sensors, inverters, and precision instruments. Customizable high-temperature and corrosion-resistant models are available to adapt to complex industrial environments.

Special and Other Fields

Nuclear industry: Used as a neutron moderator in nuclear reactors, relying on high purity and stable chemical properties to achieve neutron moderation with low absorption.

LED lighting: Used in heat dissipation modules of high-power LED lamps to improve the service life and luminous efficiency of lighting equipment.

Electrodes and sealing: Used in the manufacture of batteries and fuel cell electrodes, as well as gaskets under high-temperature working conditions, balancing thermal conductivity, electrical conductivity, and sealing functions.

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