Thermal Graphite Paper Ultra Thin

Excellent Thermal Conductivity with Distinctive Directional Conduction Advantages

Outstanding horizontal thermal conductivity: Natural graphite-based products reach ≥500W/(m·K), synthetic graphite-based products ≥700W/(m·K), and high-end models can achieve 800-1600W/(m·K). This is 2-4 times that of copper (approximately 400W/(m·K)) and over 100 times that of silica gel (≤10W/(m·K)). The in-plane thermal diffusion rate is as low as 0.8s/cm², enabling rapid elimination of local hot spots.

Clear thermal conductivity direction: The vertical thermal conductivity is relatively low (10-30W/(m·K)). It can form a complementary heat dissipation system when matched with metal heat sinks and heat pipes, maximizing thermal management efficiency.

Extreme Ultra-Thin Form Factor for Precision Scenarios

Strict thickness control: The standard thickness is ≤0.05mm, with mass production achievable at 0.025mm. The thickness tolerance is ≤±0.01mm (for specifications below 0.05mm), and the thickness variation of a single sheet is ≤0.01mm, allowing embedding into various narrow and precision structures.

Significant lightweight advantage: With a density of only 1.0-1.7g/cm³, it is 70% lighter than copper and 35% lighter than aluminum of the same size. It does not increase the overall volume and weight of devices, facilitating the design of ultra-thin products.

Excellent Physical and Chemical Stability

Reliable mechanical properties: With a tensile strength of ≥5.0MPa, it boasts excellent flexibility, allowing free cutting and bending. It can fit both flat and curved surfaces, adapting to devices with complex shapes, and is easy to composite with metals, insulating layers, and double-sided adhesives.

Strong temperature and weather resistance: The operating temperature range covers -40℃ to 400℃, and some high-end models can work stably from -200℃ to 300℃. The thermal weight loss at 450℃ is ≤1.0%, featuring high chemical stability and corrosion resistance.

Strict purity and impurity control: Ash content ≤0.50%, sulfur content ＜1000μg/g, chlorine content ≤50μg/g. High-purity models can reach a purity of 99.9%, meeting the environmental and performance requirements of high-end fields such as electronics and aerospace.

Additional Performance and Processing Convenience

Rich additional functions: Some products have an electromagnetic shielding effectiveness of ＞60dB, far exceeding that of traditional copper foil (＜30dB), capable of meeting dual requirements of heat dissipation and electromagnetic shielding.

Easy processing and customization: It can be made into any shape through die-cutting and laser engraving, supporting gradient thermal conduction channel design. The local thermal conductivity difference can reach 500W/(m·K), adapting to personalized heat dissipation needs.