1. Product Core
Focuses on balancing ultra-thin thickness, high in-plane thermal conductivity and excellent flexibility, realizing efficient, lightweight and conformal heat dissipation, and matching the miniaturization and high-performance development needs of modern electronic equipment.
2. Key Technical Parameters
|
Technical Parameter |
Typical Value (Customizable) |
Test Standard |
|
Thickness |
0.01–0.10 mm |
ASTM D374 |
|
In-plane Thermal Conductivity |
300–1500 W/(m·K) |
ASTM D5470 |
|
Density |
1.5–2.0 g/cm³ |
ASTM D792 |
|
Operating Temperature Range |
-40 ~ 200 ℃ |
ISO 18773 |
|
Tensile Strength |
≥15 MPa |
ASTM D882 |
|
Volume Resistivity |
≥1×10¹⁰ Ω·cm |
ASTM D257 |
3. Core Features
Ultra-Thin & Flexible: Thickness ranges from 0.01 mm to 0.10 mm, with good bendability and conformability. It can be closely attached to irregular surfaces of components without cracking, adapting to the compact design of equipment.
High Thermal Conductivity: In-plane thermal conductivity reaches 300–1500 W/(m·K), quickly transferring and dissipating concentrated heat, lowering device operating temperature and extending service life.
Stable Performance: Withstands high and low temperatures (-40 ℃ to 200 ℃), resists corrosion and aging. It remains stable without deformation or performance degradation in harsh environments, and provides reliable electrical insulation to avoid short circuits in precision components.
Lightweight & Environmentally Friendly: Density of 1.5–2.0 g/cm³, lighter than traditional metal heat dissipation materials (copper, aluminum), without adding extra weight to equipment. Non-toxic, odorless and pollution-free, fully compliant with environmental protection standards.
Customizable: Thickness, dimensions, cutting shape and thermal conductivity can be tailored to customer application scenarios and technical requirements.
4. Application Fields
Consumer Electronics: Smartphones, tablets, laptops, smart wearables (watches, earphones), game consoles, used for heat dissipation of CPUs, batteries, chips and other core components.
New Energy: Power battery packs, energy storage systems, new energy vehicle electronic control systems, charging piles, effectively reducing temperatures of battery modules and power devices to improve safety and stability.
Communication Equipment: 5G base stations, optical modules, routers, communication transceivers, adapting to high-power and high-heat working conditions.
Industrial & Aerospace: Medical testing instruments, industrial control panels, aerospace precision electronic components, small and medium inverters, meeting high-reliability heat dissipation requirements for high-end equipment.
This material has passed strict quality inspections. We provide free samples, technical support and one-stop customization services to satisfy diverse thermal management demands of global customers. It is widely recognized as a high-performance thermal management solution in the electronics and new energy industries.
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